Photomasks continue to be key elements within the semiconductor industry. They are used mainly in wafer steppers (mask projection lithography) or in the mask aligner (masked ion beam lithography) for the production of integrated circuits (microchips).

The choice of the substrate depends largely on the intended end use. For environments with major fluctuations in temperature, for example, substrates with low thermal expansion coefficients (Zerodur, fused silica) are used.

Photomasks as basic key elements in the semiconductor industry.

CD tolerance :+/-0.1μm-+/-0.2μm

cutting tolerance:+/-0.02-+/-0.03mm

Manufacturing tolerance affected by thickness and sizes

Photomasks as basic key elements in the semiconductor industry.

CD tolerance :+/-0.1μm-+/-0.2μm

cutting tolerance:+/-0.02-+/-0.03mm

Manufacturing tolerance affected by thickness and sizes

Photomasks as basic key elements in the semiconductor industry

CD tolerance :+/-0.1μm-+/-0.2μm

cutting tolerance:+/-0.02-+/-0.03mm

Manufacturing tolerance affected by thickness and sizes

Photomasks as basic key elements in the semiconductor industry.

CD tolerance :+/-0.1μm-+/-0.2μm

cutting tolerance:+/-0.02-+/-0.03mm

Manufacturing tolerance affected by thickness and sizes